Sep 23, 2026 · 30 min · 10 segments
Daniel is joined by Aveek Sarkar, who heads TSMC’s Ecosystem and Alliance Management Division. Along with his team, he is responsible…
Aveek SarkarGuest
Daniel NenniHost
The TSMC OIP ecosystem is widely recognized as the industry's most comprehensive network of long-term design partners.
What are some of the most notable recent collaborations or milestones you've achieved?
But the work with our design partners, design enablement partners, our IP partners, and other constituents started many, many years ago before that.
It was an important and required step to enable this journey of TSMC to develop and deliver the PurePlay Foundry model for our customers.
The process that we went through in collaboration with our partners led to the eventual formation of OIP, which formalized the method and the process in which we interact with our partners and deliver the combined and joint solutions.
Now, if you look at some of the outcomes that we have achieved throughout this process, we have now reference flows, certified tools as part of our EDA Alliance, 100,000 plus titles and IPs as part of our IP Alliance.
secure certified cloud environments as part of our cloud alliance, certify your design methodologies and services from our DCA and VCA partners.
We continue to work with our partners right in a sustained manner on all the different things our customers need to be doing from a design flow enablement or the latest nodes from making sure they have the IPs available.
They have the design services available and those happen on a continuous basis.
But what I'm really excited about is some of the new initiatives that we have started to roll out this year.
As we look at the technologies that we are creating, the power efficiency gains that we are delivering, right, through DTCO and all these other optimizations that we do, it's not just about the technology our customers need to be able to use them effectively and efficiently and this is where we have expanded our collaboration with the ecosystem partners in standardizing some of the reference flows some of the training methodologies and in enabling our customers with the access to those especially the startups and the emerging customers who are coming up with their solutions and we want to accelerate that significantly One of the newer things we did also this year was brought some of our alliance members to collaborate with each other in which our EDA alliance members actually conducted advanced node training for our design service partners.
What that does, it upskills and elevates the knowledge and the learning the design service community have so that when they go and they work on our customers' projects, they're able to deliver much more effective outcomes for them.
Now, that's, you know, when we look at compute and, you know, how do you get our customers going on that? The second is our focus on design productivity.
We started with AI based, you know, optimization flows using reinforcement learnings.
But then as agentic AI and the workflows start to become more of available technologies, and this is where we are really excited in how do we work with our partners to deploy these into our customer workflows as well.
so we have identified few areas and this year in oip we are highlighting them in digital workflows for example we are seeing through the combination of the agentic framework and what we are calling the TSMC AI design kit, certain elements that are geared towards enabling an AI-first design methodologies.
We're seeing like 3-5x better productivity in PPA gains for digital designs or 6x productivity improvements for analog circuit migration.
The TSMC OIP ecosystem is widely recognized as the industry's most comprehensive network of long-term design partners.
What are some of the most notable recent collaborations or milestones you've achieved?
But the work with our design partners, design enablement partners, our IP partners, and other constituents started many, many years ago before that.
It was an important and required step to enable this journey of TSMC to develop and deliver the PurePlay Foundry model for our customers.
The process that we went through in collaboration with our partners led to the eventual formation of OIP, which formalized the method and the process in which we interact with our partners and deliver the combined and joint solutions.
Now, if you look at some of the outcomes that we have achieved throughout this process, we have now reference flows, certified tools as part of our EDA Alliance, 100,000 plus titles and IPs as part of our IP Alliance.
secure certified cloud environments as part of our cloud alliance, certify your design methodologies and services from our DCA and VCA partners.
We continue to work with our partners right in a sustained manner on all the different things our customers need to be doing from a design flow enablement or the latest nodes from making sure they have the IPs available.
They have the design services available and those happen on a continuous basis.
But what I'm really excited about is some of the new initiatives that we have started to roll out this year.
As we look at the technologies that we are creating, the power efficiency gains that we are delivering, right, through DTCO and all these other optimizations that we do, it's not just about the technology our customers need to be able to use them effectively and efficiently and this is where we have expanded our collaboration with the ecosystem partners in standardizing some of the reference flows some of the training methodologies and in enabling our customers with the access to those especially the startups and the emerging customers who are coming up with their solutions and we want to accelerate that significantly One of the newer things we did also this year was brought some of our alliance members to collaborate with each other in which our EDA alliance members actually conducted advanced node training for our design service partners.
What that does, it upskills and elevates the knowledge and the learning the design service community have so that when they go and they work on our customers' projects, they're able to deliver much more effective outcomes for them.
Now, that's, you know, when we look at compute and, you know, how do you get our customers going on that? The second is our focus on design productivity.
We started with AI based, you know, optimization flows using reinforcement learnings.
But then as agentic AI and the workflows start to become more of available technologies, and this is where we are really excited in how do we work with our partners to deploy these into our customer workflows as well.
so we have identified few areas and this year in oip we are highlighting them in digital workflows for example we are seeing through the combination of the agentic framework and what we are calling the TSMC AI design kit, certain elements that are geared towards enabling an AI-first design methodologies.
We're seeing like 3-5x better productivity in PPA gains for digital designs or 6x productivity improvements for analog circuit migration.
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