Power electronics is driving major shifts like EV powertrains, AI data centers, and industrial electrification—but module performance and reliability also hinge on “behind-the-scenes” materials. Critical elements like die attach, encapsulants, and thermal interface materials can determine whether a power module withstands years of thermal cycling, high current, and harsh operating conditions. On PowerUP, you’ll be joined by Burcak Conley (Head of Application Engineering for North America & Europe at Henkel) to discuss what’s driving demand and how packaging materials are evolving to meet higher thermal and reliability needs. You’ll also explore where Henkel sees the biggest opportunities ahead in this space.
