... power modules push towards higher thermal loads and stricter reliability requirements, um, how is this shaping what customers are asking for in te- in terms of, say, die attach adhesives, encapsulants, wire bonding, and other packaging materials?

Yeah, you're correct.

I mean, Henkel has been supporting wire bond packaging and die attach for more than 50 years, with some of our early products still actively used as the gold standard for reliability and performance in traditional die attach applications today.

Throughout the years, we continuously invested in innovation to meet the challenging demands of this market.

And, uh, to be honest, it's very interesting time for us to be the leading material suppliers as we see power modules undergo further development and more and more challenges comes with it, and of course, more and more innovation is needed from us.

And, um, today our customers asking for packaging materials with the capability to handle higher current density, higher operating temperature, higher thermal and reliability requirements, and all for a reasonable cost.

And if you look at deeper, for example, in electrical vehicle industry, in DC to DC converters, with the adaptation of silicon carbide die to improve reliability, pressure-assisted silver sintering material is widely used today as a die attach.

Mm