It's getting the model to remember the right things and then using those things to go do tasks.

Generally, people think about this market a bit lazily, or they say, "Are you a prefill chip? Are you a decode chip? If you're a decode chip, are you an HPM chip? Are you an SRAM chip? Are you a 3D DRAM chip? Are you using optics? Using copper?" When we started this, we just wanted to understand why extremely smart people were working on these different directions.

We seriously looked at architectures like having a bunch of DDR me- memory and, like, a shared memory pool and looking at advanced packaging to basically break out of the shoreline.

We looked at things like, is there ways to put memory dies on top of compute dies? In doing so, we realized that there's no free lunch.

Everything is a trade-off, right? 3D DRAM, you have a thermal issue, you have a supply chain issue, you have to figure out hybrid bonding, you have to figure out the flops, so now you're a decode chip.

So we went through everything, both on the prefill and the decode side.

In doing so, we realized there's a few design spaces that nobody had seriously tried to explore because they were never done in AI chips.

I'm most interested in your motivation ultimately for being here doing this thing.