How has this changed the ways INTEC approaches the design of magnetic components, but also current sensing, passive technologies, and where do you see the biggest technical challenges today?

I think the biggest challenge today for the AI data center is the power consumption increased dramatically.

For the single chip, it used to be like the couple hundred watts, now easily go to the two to three kilowatts.

So in order to handle this power, we need a very high efficiency power devices.

And also, in the data center, each computing tray has a very limited space footprint as well.

So the GAN indeed provides very good performance because you have to operate at a higher frequency, you can reduce the size footprint, and you have a higher density to support the demanding of the current.

So compared to the silicon, GaN devices show these superior opportunities and the performance to meet the AID hospital requirements.

So from the passive components perspective, point of view, I mean, what innovations are most critical to meeting these requirements? And where do you see the greatest opportunity for improvement? And if we would look Forward, do you see innovations in packaging that will be becoming key differentiators for the next generation AI and high-density power systems? Which area excites you the most?