Um, that's I'm sure given you a lot of time to, uh, identify some very important challenges in simulation analysis as you've been working with customers.

Yeah, that's a, that's a great question.

And, you know, it's funny, the challenges are definitely not getting easier.

People are dealing with more crosstalk challenges.

Like, you look at the density of the ASICs today, we're still state-of-the-art, right? One millimeter or .8 millimeter pitch for a lot of the BGA packages out there.

Um, the current density is just going up.

A lot of customers unofficially are pushing greater than three amps per ball on a lot of these packages while, you know, shooting 224G or greater through these SerDes coming out.

... or is there something else?